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High-Precision 80W Mopa Laser Scribing Machine for Wafer Processing
Laser Scribing Machine — Type Semiconductor Laser, Standard Modular Design Standard Modular Design. MOQ 1 piece, US$70,000.00 – 200,000.00/piece.
- Type
- Semiconductor Laser
- Warranty
- 12 Months
- After-sales Service
- 7*24 Hours
- Customized
- Non-Customized
- Standard Modular Design
- Standard Modular Design
- Cooling System
- Air Cooling
At a glance
- Product
- High-Precision 80W Mopa Laser Scribing Machine for Wafer Processing
- Category
- Laser Scribing Machine
- Price
- US$70,000.00 – 200,000.00 / piece
- Minimum order
- 1 piece
- Origin
- China
- Customization
- Available
- Packaging
- Crate
Last updated
Specifications
| Customization | Available |
|---|---|
| After-sales Service | 7*24 Hours |
| Warranty | 12 Months |
| Model NO. | LPM-01 |
| Customized | Non-Customized |
| Standard Modular Design | Standard Modular Design |
| Cooling System | Air Cooling |
| Applicable Material | Nonmetal |
| Technical Class | Pulse Laser |
| Type | Semiconductor Laser |
| Laser Power | 80W Mopa |
| Laser Wavelength | 1064 Nm |
| Max. Scribing Speed | 600 mm/S |
| Line Width | < 40 Um |
| Scribing Depth | 0 - 200 Um |
| Scribing Accuracy | +/- 0.1 mm |
| Positioning System | CCD Vision System |
| Compatible Wafer Size | 156 * 156 mm to 168 * 168 mm |
| Equipment Weight | 1200 Kg |
| Transport Package | Crate |
| Specification | 12, 140 * 1, 440 * 1, 800 mm |
| Origin | China |
| Production Capacity | 1000 |
| MOPA Laser Source | Allows independent control of pulse parameters for optimal scribing quality on brittle silicon. |
| CCD Vision Positioning | Enables high-precision alignment, critical for thin and fragile wafers. |
| Controlled Mechanical Cleaving | Provides a clean, reliable break after the laser scribing process. |
| Laser Scribing Machine - Technical Datasheet | |
|---|---|
| Parameter | Specification |
| Model | SHL2-4000V19 |
| Laser Power | 80W MOPA |
| Laser Wavelength | 1064 nm |
| Max. Scribing Speed | 600 mm/s |
| Line Width | < 40 Um |
| Heat Affected Zone (HAZ) | < 80 um |
| Scribing Depth | 0 - 200 um (Adjustable) |
| Scribing Accuracy | ± 0.1 mm |
| Positioning System | CCD Vision System |
| Cleaving Method | Mechanical Cleaving |
| Throughput | 3200 wafers/hour |
| Breakage Rate | < 1% (for Grade A+ wafers) |
| Compatible Wafer Size | 156 * 156 mm to 168 * 168 mm |
| Equipment Dimensions (L*W*H) | 1214 * 1440 * 1800 mm |
| Equipment Weight | 1200 kg |
| Package Component | Specification | Purpose |
|---|---|---|
| Primary Package | IPPC ISPM 15 Standard Solid Wooden Case, reinforced with steel straps. | Protects against physical impact, moisture, and pests. Meets international phytosanitary regulations. |
| Internal Cushioning | High-density foam, custom-molded to the machine's shape. | Absorbs shocks and vibrations, preventing movement inside the case. |
| Weatherproofing | Heavy-duty plastic wrapping and desiccant bags placed inside the case. | Protects against humidity, rain, and salt spray during transit. |
| Component Securing | All internal components are bolted to the machine frame; loose parts are secured in custom foam-lined boxes within the main crate. | Prevents damage from internal shifting. |
| Labeling | External labels with handling icons (Fragile, This Side Up, Keep Dry), machine model, gross weight, and dimensions. |
Product details
High-Precision 80W Mopa Laser Scribing Machine for Wafer Processing is a laser scribing machine product (semiconductor laser) manufactured in China and available to buyers worldwide through the GoodsFromChina sourcing service.
Key features
- Type: Semiconductor Laser
- Warranty: 12 Months
- After-sales Service: 7*24 Hours
- Customized: Non-Customized
- Standard Modular Design: Standard Modular Design
- Cooling System: Air Cooling
- Applicable Material: Nonmetal
- Technical Class: Pulse Laser
MOPA Laser Source
Allows independent control of pulse parameters for optimal scribing quality on brittle silicon.
Ordering & packaging
Minimum order quantity is 1 piece. Standard export packaging: Crate. Every order can include a pre-shipment quality inspection and consolidated shipping by sea, air or express, including DDP delivery.
How we source this product for you
- 1
Send your inquiry
Choose options, quantity and requirements. No payment needed.
- 2
Get a factory quote
We confirm price, MOQ and lead time — and compare alternatives.
- 3
Production & inspection
We follow up production and inspect goods before shipment.
- 4
Delivered to your door
Sea, air or express with customs clearance and DDP options.
Frequently asked questions
What is the minimum order quantity for High-Precision 80W Mopa Laser Scribing Machine for Wafer?
The MOQ is 1 piece. Smaller trial orders can sometimes be negotiated — tell us your quantity in the inquiry.
How much does High-Precision 80W Mopa Laser Scribing Machine for Wafer cost?
The listed factory price is US$70,000.00 – 200,000.00 per piece, depending on quantity. Your final quote includes our service fee and shipping options.
Can it be customized with my logo or specifications?
Yes. The manufacturer offers customization — logo printing, packaging, colors or modified specifications. Describe your requirements in the inquiry form.
How long does production and shipping take?
Typical production time is 15–45 days depending on quantity. Shipping to the US takes about 5–8 days by express, 8–12 days by air and 25–40 days by sea, with DDP door-to-door delivery available.
How do you check product quality?
We verify the manufacturer before ordering and can perform a pre-shipment inspection (AQL sampling) with a photo report before you pay the balance.
