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T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58
Welding Flux — Type Resin, Application SMT Soldering. MOQ 30 kg, US$30.00 – 80.00/kg. Verified factory; QC & shipping by GoodsFromChina.
- Type
- Resin
- Application
- SMT Soldering
- Function
- Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow
- Melting Point
- 200℃-300℃
- Chemical Composition
- Tin Lead Silver Copper
- Manufacturing Method
- Smelting
At a glance
- Product
- T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd…
- Category
- Welding Flux
- Price
- US$30.00 – 80.00 / kg
- Minimum order
- 30 kg
- Origin
- China
- Customization
- Available
- Packaging
- Foam Box
- HS code
- 3810100000
Last updated
Specifications
| Model NO. | Solder Paste |
|---|---|
| Type | Resin |
| Melting Point | 200℃-300℃ |
| Chemical Composition | Tin Lead Silver Copper |
| Function | Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow |
| Application | SMT Soldering |
| Manufacturing Method | Smelting |
| Alloy | Lead Free |
| Alloy 2 | Sac305 Sn96.5AG3.0cu0.5 |
| Alloy 3 | Sac0307 Sn99AG0.3cu0.7 |
| Alloy 4 | Sn42bi58 Low Temperature |
| Powder Size | Type 3: 25 to 45 Microns |
| Powder Size 2 | Type 4: 20 to 38 Microns |
| Flux | No Clean Flux |
| Certificate | RoHS |
| Packing | Jar |
| Packing 2 | Syringe |
| Shipping | Courier / Air Freight |
| Shelf Life | 6months |
| Storage | 0 to 10 Degree Celsius |
| Application 1 | SMD Soldering |
| Application 2 | SMT Soldering |
| Transport Package | Foam Box |
| Specification | 100g to 1000g |
| Origin | China |
| HS Code | 3810100000 |
| Production Capacity | 30tons/Month |
| Package Size | 10.00cm * 10.00cm * 10.00cm |
| Package Gross Weight | 1.500kg |
| Customization | Available |
| state | Liquid |
| pH | Neutral |
| Shipping Cost | Contact the supplier about freight and estimated delivery time. |
| Lead Free Solder Paste | Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc |
| Leaded Solder Paste | Sn63Pb37, Sn60Pb40, Sn50Pb50 etc |
| Consumer Electronics | I |
| Automotive Electronics | The solder paste is suitable for soldering critical components in automotive electronics systems. |
| Stencil Printing | Prepare the right stencil and apply solder paste SAC305 through the stencil onto designated solder pads on a printed circuit board (PCB). |
| Place SMD components | Accurately place surface mount components onto the solder paste-covered pads. This can either be done by high accurate automatic SMT soldering machine, or manually placed by tweezers. |
| Conduct the Reflow Soldering | Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering. For small DIY projects, using hot air gun to conduct the soldering is also workable. |
Product details
T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58 is a welding flux product (resin) manufactured in China and available to buyers worldwide through the GoodsFromChina sourcing service. Typical uses include SMT Soldering.
Key features
- Type: Resin
- Application: SMT Soldering
- Function: Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow
- Melting Point: 200℃-300℃
- Chemical Composition: Tin Lead Silver Copper
- Manufacturing Method: Smelting
- Alloy: Lead Free
- Alloy 2: Sac305 Sn96.5AG3.0cu0.5
Automotive Electronics
The solder paste is suitable for soldering critical components in automotive electronics systems.
Stencil Printing
Prepare the right stencil and apply solder paste SAC305 through the stencil onto designated solder pads on a printed circuit board (PCB).
Place SMD components
Accurately place surface mount components onto the solder paste-covered pads. This can either be done by high accurate automatic SMT soldering machine, or manually placed by tweezers.
Conduct the Reflow Soldering
Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering. For small DIY projects, using hot air gun to conduct the soldering is also workable.
Ordering & packaging
Minimum order quantity is 30 kg. Standard export packaging: Foam Box. HS code: 3810100000. Every order can include a pre-shipment quality inspection and consolidated shipping by sea, air or express, including DDP delivery.
How we source this product for you
- 1
Send your inquiry
Choose options, quantity and requirements. No payment needed.
- 2
Get a factory quote
We confirm price, MOQ and lead time — and compare alternatives.
- 3
Production & inspection
We follow up production and inspect goods before shipment.
- 4
Delivered to your door
Sea, air or express with customs clearance and DDP options.
Frequently asked questions
What is the minimum order quantity for T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow?
The MOQ is 30 kg. Smaller trial orders can sometimes be negotiated — tell us your quantity in the inquiry.
How much does T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow cost?
The listed factory price is US$30.00 – 80.00 per kg, depending on quantity. Your final quote includes our service fee and shipping options.
Can it be customized with my logo or specifications?
Yes. The manufacturer offers customization — logo printing, packaging, colors or modified specifications. Describe your requirements in the inquiry form.
How long does production and shipping take?
Typical production time is 15–45 days depending on quantity. Shipping to the US takes about 5–8 days by express, 8–12 days by air and 25–40 days by sea, with DDP door-to-door delivery available.
How do you check product quality?
We verify the manufacturer before ordering and can perform a pre-shipment inspection (AQL sampling) with a photo report before you pay the balance.
